product id: 70806
An air reflow, RMA solder paste designed for use in a wide range of environmental conditions. It has exceptional stencil life and tack strength plus offers consistent print definition even in ultrafine-pitch applications. With a wide processing window, it can be used with standard eutectic SnPb, SnPbAg and high-temperature alloys, including AuSn, SnSb and SnAg.
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