Indium Solder PASTEOT-801663-600G Solder Paste, 6.6HF, T4, SN62.6/PB37/AG0.4, 600g Cartridge

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Indium 6.6HF Water Soluble, PB Free & SNPB Solder Paste Datasheet

Specifications:

• Alloy Grouping: SnPb Near-Eutectic
• Indalloy #: 100 (no common name)
• Composition: SN 62.6/PB 37/AG 0.4
• T4: 89.5%

Features:

• Low-voiding water-soluble flux for solder paste:
  
  Reduced largest voids
  Fewer voids
  Minimized voiding overall
  For BGA, CSP, and bottom termination components, such as QFNs and DPAKs
• Exceptional printing process window:
  
  Excellent response-to-pause
  
  Long stencil life
  
  Prints consistently at a wide range of speeds
• Wide reflow process window
• Excellent wetting on a variety of surface finishes
• Maintains tack over time
• Outstanding cleanability

Indium6.6HF is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.

It exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).