Indium Solder 801080-600G Solder Paste, Sn63/Pb37, RMA-155, T3, 600g Cartridge

• Halogen-free per EN14582 test method
• High-performance stencil printing characteristics
• Eliminates hot and cold slump
• Robust reflow performance to accommodate assembly of BGA and components with large ground planes
• High oxidation resistance
• Clear, probe-testable post-reflow residues
• Maintains very high resistance during SIR testing
• Ideal for mixed alloy SnPb and Pb-free processes
• Sn63Pb37 - Printing Metal Load 90%

RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. Its balanced performance is suited for a wide variety of processes including: consistent stencil printing transfer, robust reflow window, and residue compatible with in-circuit testing.

RMA-155 is designed to be reliable without needing to be cleaned. However, the flux can be removed, if necessary, by using a commercially available flux residue remover (i.e., semi-aqueous, solvent based, or vapor degreaser).

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