Small Precision Tools 2005639 Wire Bonding Capillary, Gold, 16mm, .0043" Tip dia, SBN Series

• For deep access applications VBN, VR=6350 MD=1067. Provides vertical clearance between adjacent high-loop profile and die edge
• Fine matte tip finish provides better stitch adhesion and ensures smoother exit of wire during looping
• Alumina Zirconia properties: Hardness (HV1) 2000; Grain size µm <0.9; Density g/cm³ 4.25

Small Precision Tools utilizes a state-of-the-art Ceramic Injection Molding (CIM) technology in the creation of its wire bonding capillaries, which meets tight tolerances. The Molded Slimline Bottle capillaries (SBN) series is intended for fine-pitch application for Bond Pad Pitch (BPP) 125µm up to as fine as 70µm. The integration of the new AZ composite material into Slimline Bottleneck (SBN) capillary has set a new milestone in the micro-packaging technology for application of ultra-fine pitch bonding. The higher strength SBN-AZ configuration is offered with T 110µm.

SPT Bonding Capillaries Fine Pitch SBN Series Specs
SPT Bonding Capillaries Bonding Evolution Brochure