ALPHA HiTech 249781.0060GM Capillary Underfill, CU31-3100, Low CTE, 50cc EFD Syringe

• Excellent Thermal Cycling performance
• Releases stress over a large area, primary stress is CTE mismatch between component and board
• High Glass Transition Temperature
• Low Coefficient of Thermal Expansion
• Halogen Free
• Complies with RoHS Directive 2011/65/EU

ALPHA HiTech CU31-3100, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. Good underfill capillary flow can be achieved by preheating the devices at 70 – 100°C during the dispensing process.