Chip Quik SMD291SNL Solder Paste no clean Lead-Free in 5cc syringe 15g (T3)

• Halogen-free
• Compatible with SnPb alloys
• Low BGA, CSP, QFN voiding
• Stable paste
• High transfer efficiency through small apertures
• Eliminates hot and cold slump
• High oxidation resistance
• Wets well to oxidized BGA and pad surfaces
• Excellent soldering performance under high-temperature and long reflow processes
• Clear, probe testable flux residue

An air reflow, no-clean solder paste formulated to accommodate the higher processing temperatures of SnAgCu, SnAg, and other alloy systems favored by the electronics industry. Indium8.9HF offers stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of the 8.9HF minimizes false failures in ICT. It is one of Indium's lowest voiding pastes.

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