AIM Metals SN63-M8-T4-600C Solder Paste, No Clean, 700g

• Lowest voiding water-soluble flux for solder paste
• Exceptional printing process window
• Excellent wetting

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.

Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).

Indium Solder Paste Safety Datasheet