Indium Solder IND-800420-600C No-Clean Solder Paste, 8.9 Type 4 SAC305, 600g Cartridge

• Defect Elimination: Eliminates head-in-pillow defects Low voiding: Less than 5% voiding for BGAs with via-in-pad technology, even when using a variety of profiles
• Printing: Designed for CSP, 0201, and 01005 technologies
• Reflow Capability: Accommodates high peak temperatures and long soak profiles

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.