- Halogen-Free
- Unique Oxidation Barrier Technology; No more head-in-pillow defects; Strong oxidation barrier
- Low voiding (less than 5%) for many profiles when soldering BGAs with via-in-pad technology
- Robust Reflow Capability
- Indium 8.9HF-1 Only: Provides best-in-class probe-testability with few false rejects from in-circuit testing. Extremely thermally stable and maintains soft, pliable residue, even after reflow
Image shown is a representation of actual product.
Indium 8.9HF1 PB-Free Solder Paste Datasheet
