Kester 70-0902-0510 Solder Paste, No-Clean, Leaded, Sn63Pb37, 500g Jar, Fl250D Series

Kester FL250D Solder Paste Product Overview:

Alloy: Sn63Pb37

Kester FL250D is a no-clean, air or nitrogen reflowable solder paste specifically designed for automotive requirements. FL250D is compatible with post-soldering process chemicals, including conformal coatings and potting compounds. FL250D is capable of stencil printing downtimes of up to 90 minutes with an effective first print at 20 mils. FL250D also has the capability of printing up to 8in/sec (200 mm/sec) with squeegees or within an enclosed head.

Performance Characteristics:

• Excellent residue characteristics that are completely compatible with conformal coating and potting processes
• High print speeds to 200mm/sec (8 in/sec)
• Compatible with 0201 technology
• Excellent printing characteristics to 0.4 mm (16-mil) pitch with Type 3 powder
• Classified as ROL0 per J-STD-004
• Excellent wetting on a variety of substrates, including OSPs
• Capable of 90 minute break times in printing
• Stencil life: 8+ hours (process dependent)
• Scrap is reduced due to less paste dry out
• Stable tack over 8+ hours
• Compatible with DEK ProFlow and MPM RheoPump enclosed print head systems

Powder Size: 3

Screen/Stencil Printing