Kester 7050232210 Solder Paste, Water Soluble, Lead Free, Sn96.5Ag3Cu.5 (SAC305), 88.3 %, T5, 500 g Jar, WP616 Series

• Superior reflow characteristics
• Classified as ORM0 per J-STD-004B
• Excellent activity and printability
• Zero-Halogen (none intentionally added)
• Wide reflow profile window with good solderability
• Reflowable in air and nitrogen conditions
• Cleaning can be accomplished with heated de-ionized water

WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. Offers a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition. Classified as ORM0 flux under IPC J-STD-004B.
Click Here to Read the Kester WP616 Technical Data Sheet