product id: 70788
An air reflow, no-clean solder paste formulated to accommodate the higher processing temperatures of SnAgCu, SnAg, and other alloy systems favored by the electronics industry. Indium8.9HF offers stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of the 8.9HF minimizes false failures in ICT. It is one of Indium's lowest voiding pastes.
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