ALPHA HiTech CF31-4010 is an epoxy- based material to be dispensed on the edges (edge bonding) or corners (corner bonding) of the BGA devices. An excellent lower cost option to conventional underfilling process with increased productivity and lower material volume required. High Tg and Low CTE values drastically improve the product’s ability to pass a more stringent Thermal Cycling Test condition. Although ALPHA HiTech CF31-4010 is a high Tg, low CTE and high filler content material, it is reworkable. Halogen-free and complies with RoHS Directive 2015/863/EU.
